英语翻译
问题描述:
英语翻译
FIG.2 illustrates a crosssectional view of the packaged IC of FIG.1 at a stage in processing inaccordance with one embodiment of the present disclosure.
答
图2示出的是图1的封装的IC的横截面视图,该封装IC处于根据本发明的一个实施例加工的阶段中.
其中“IC”应该是Integrated Circuit,即集成电路