请会英文翻译的人帮我翻译下简历(英译汗)-34. Education 1998.9-2003.7, JSIT. Jiangsu College of Information Technology. Major in: Integrated Circuit Manufacturing Technology. Main Subject as bellow: Physics of Semiconductor Devices. Ultra large scale (ULC) integrated circuit process. Bonding technique of integrated circuit/discrete device. Foundation of Circuit. Thin/Thick Film Integrated Circuit Process. Electronic Application Technology. Analog integrated circuit. C Lan

请会英文翻译的人帮我翻译下简历(英译汗)-3
4. Education
1998.9-2003.7, JSIT.
Jiangsu College of Information Technology.
Major in: Integrated Circuit Manufacturing Technology.
Main Subject as bellow:
Physics of Semiconductor Devices.
Ultra large scale (ULC) integrated circuit process.
Bonding technique of integrated circuit/discrete device.
Foundation of Circuit.
Thin/Thick Film Integrated Circuit Process.
Electronic Application Technology.
Analog integrated circuit.
C Language etc…
5. Certification
Certification Institution: China Information industry Ministry
Senior Engineer---Semiconductor chip manufacture.
Senior Engineer--- Senior Engineer--Semiconductor Assembly Process & Application.
Certification Institution: Gallant Micro Machining Corporation
Mold Manufacturing & Assembling Intern Diploma Certification