HSOP是什么封装,英文全称是什么,谢谢
问题描述：
HSOP是什么封装,英文全称是什么,谢谢
答
Heatsink Small Out-Line Package （带散热片的小尺寸封装）
HSOP is a surface mount package with ìgull wingî lead form.This package has
a mechanically attached thick Copper (Cu) heat slug to improve the thermal performance.The
exposed heat slug provides a direct path for heat conduction awayfrom an IC and into a solder
attached Printed Circuit Board (PCB).