Device IC damage influence in no device testing the module was verified through de-processing analysis.no device was cau

分类: 作业答案 • 2021-12-17 20:29:06

问题描述：

Device IC damage influence in no device testing the module was verified through de-processing analysis.no device was caused by device IC damage.

答

通过过程分析可以确定集成电路的损坏不会对检测模块造成影响.装置也不会受集成电路的影响.
表达没有错误,就是那个词：deprocessing没怎么听过呢,不过不影响意思的理解